Thermal Calculator
Calculate junction temperature, thermal resistance, and heatsink requirements for electronic components
Input Parameters
25°C40°C50°C70°C85°C
125°C150°C175°C
SOT-23SOT-223TO-92TO-220TO-220 + HeatsinkTO-247QFN-32 (5x5)QFP-48BGA-256DIP-8
θJA (Total)
62.00 °C/W
θJC + θCS + θSA
Tj (Junction Temp)
87.0 °C
SAFETc (Case Temp)
85.5 °C
Ts (Sink Temp)
85.0 °C
Maximum Allowable Power
2.016 W
Pd_max = (Tj_max - Ta) / θJA = (150 - 25) / 62.00
Temperature Rise ΔT
62.0 °C
ΔT = Pd x θJA = 1 x 62.00
Thermal Resistance Chain Diagram
Junction Case Sink Ambient
Tj Tc Ts Ta
87.0°C 85.5°C 85.0°C 25.0°C
│ │ │ │
├──── θJC ────────┤──── θCS ────────┤──── θSA ───────┤
│ 1.5 °C/W │ 0.5 °C/W │ 60.0 °C/W │
│ │ │ │
├─── ΔT: 1.5°C ──┤─── ΔT: 0.5°C ──┤─── ΔT: 60.0°C ─┤
│ │
└────────── θJA = 62.00 °C/W ─────────────┘
ΔT(total) = 62.0°C
Power: Pd = 1 W
Tj = Ta + Pd x θJA = 25 + 1 x 62.00 = 87.0°CSafe Operating Area
0°CSAFE (<105°C)WARN (<135°C)DANGER150°C
Current Tj: 87.0°C / 150°C (58.0%)
Package Thermal Resistance Comparison(Pd = 1 W, Ta = 25°C)
| Package | θJC | θCS | θSA | θJA | Tj | Pd_max |
|---|---|---|---|---|---|---|
| SOT-23 | 80 | 50 | 100 | 230 | 255.0°C | 0.543 W |
| SOT-223 | 15 | 5 | 40 | 60 | 85.0°C | 2.083 W |
| TO-92 | 50 | 30 | 120 | 200 | 225.0°C | 0.625 W |
| TO-220 | 1.5 | 0.5 | 60 | 62 | 87.0°C | 2.016 W |
| TO-220 + Heatsink | 1.5 | 0.5 | 8 | 10 | 35.0°C | 12.500 W |
| TO-247 | 0.5 | 0.3 | 40 | 40.8 | 65.8°C | 3.064 W |
| QFN-32 (5x5) | 5 | 5 | 25 | 35 | 60.0°C | 3.571 W |
| QFP-48 | 10 | 5 | 30 | 45 | 70.0°C | 2.778 W |
| BGA-256 | 3 | 2 | 15 | 20 | 45.0°C | 6.250 W |
| DIP-8 | 30 | 10 | 60 | 100 | 125.0°C | 1.250 W |